300 mm Wafer Electro Plating (ECD) Platform - PR431566-2480-W k Referenznummer der Bekanntmachung: PR431566-2480-W k
Auftragsbekanntmachung
Lieferauftrag
Abschnitt I: Öffentlicher Auftraggeber
Postanschrift: Hansastraße 27c
Ort: München
NUTS-Code: DE212 München, Kreisfreie Stadt
Postleitzahl: 80686
Land: Deutschland
Kontaktstelle(n): Corporate Procurement - Scientific Devices
E-Mail:
Internet-Adresse(n):
Hauptadresse: https://vergabe.fraunhofer.de/
Abschnitt II: Gegenstand
300 mm Wafer Electro Plating (ECD) Platform - PR431566-2480-W k
300 mm Wafer Electro Plating (ECD) Platform
IPMS
An der Bartlake 5
01109 Dresden
1 pc of 300 mm Wafer Electro Plating (ECD) Platform with options:
5.5.1 Hardware Compatibility Options
5.5.2 Precision Drive Head Upgrade Option
5.5.3 Pre-Aligner Upgrade Option
5.5.4 Dry Ring Upgrade Option
5.5.5 Spin Rinse Dry Chamber Upgrade Option
5.5.6 Further Chamber Upgrade Options
5.5.7 Indium Plating Process for Wafer Level Packaging Applications:
-5.2.10.1 General plating bath parameters
-5.2.10.2 POR plating bath (wider range is better; (Inorganics & concentrations (g/L, ppm); Additive package & concentrations (mL/L)
Plating Bath Temperature (°C): min, max, target; Electrolyte flow rate (L/min): min, max, target
-5.2.10.3 WLP feature fill capability
-5.2.10.4 Current set values
-5.2.10.5 Current density
-5.2.10.5 Plating steps
-5.2.10.6 Film Thickness and Uniformity (100% open area, edge exclusion: 5 mm)
-5.2.10.7 Sheet resistance (1000 nm Indium)
-5.2.10.8 Wafer rotation (rpm): POR target, min, max
-5.2.10.9 Paddle speed: POR target, min, max
-5.2.10.10 Purity of plated Indium films
-5.2.10.11 Film crystallinity Avg. grain size
-5.2.10.12 Film crystallinity Preferred texture)
-5.2.10.13 Film crystallinity Avg. Surface roughness (process of record)
-5.2.10.14 Total POR process time per wafer
5.6.1 Additive Dosing System
5.6.2 Electrolyte Degassing System
5.6.3 DI Prewet Degassing System
5.5.1 Hardware Compatibility Options
5.5.2 Precision Drive Head Upgrade Option
5.5.3 Pre-Aligner Upgrade Option
5.5.4 Dry Ring Upgrade Option
5.5.5 Spin Rinse Dry Chamber Upgrade Option
5.5.6 Further Chamber Upgrade Options
5.5.7 Indium Plating Process for Wafer Level Packaging Applications:
-5.2.10.1 General plating bath parameters
-5.2.10.2 POR plating bath (wider range is better; (Inorganics & concentrations (g/L, ppm); Additive package & concentrations (mL/L)
Plating Bath Temperature (°C): min, max, target; Electrolyte flow rate (L/min): min, max, target
-5.2.10.3 WLP feature fill capability
-5.2.10.4 Current set values
-5.2.10.5 Current density
-5.2.10.5 Plating steps
-5.2.10.6 Film Thickness and Uniformity (100% open area, edge exclusion: 5 mm)
-5.2.10.7 Sheet resistance (1000 nm Indium)
-5.2.10.8 Wafer rotation (rpm): POR target, min, max
-5.2.10.9 Paddle speed: POR target, min, max
-5.2.10.10 Purity of plated Indium films
-5.2.10.11 Film crystallinity Avg. grain size
-5.2.10.12 Film crystallinity Preferred texture)
-5.2.10.13 Film crystallinity Avg. Surface roughness (process of record)
-5.2.10.14 Total POR process time per wafer
5.6.1 Additive Dosing System
5.6.2 Electrolyte Degassing System
5.6.3 DI Prewet Degassing System
Abschnitt III: Rechtliche, wirtschaftliche, finanzielle und technische Angaben
Directlink to documents with Selection criteria: (URL) https://vergabe.fraunhofer.de/NetServer/SelectionCriteria/54321-Tender-189ff076aa6-6966c51ff21260de
Directlink to documents with Selection criteria: (URL) https://vergabe.fraunhofer.de/NetServer/SelectionCriteria/54321-Tender-189ff076aa6-6966c51ff21260de
Directlink to documents with Selection criteria: (URL) https://vergabe.fraunhofer.de/NetServer/SelectionCriteria/54321-Tender-189ff076aa6-6966c51ff21260de
In the event that subcontractors are used, they must be named and their suitability is likewise to be substantiated on the basis of the listed documents under III.1). Furthermore, it must be confirmed that they will be available if the order is placed; their share in the scope of the contractual object must be stated.
Abschnitt IV: Verfahren
Abschnitt VI: Weitere Angaben
Postanschrift: Villemombler Straße 76
Ort: Bonn
Postleitzahl: 53123
Land: Deutschland
Applications for review are not permitted if more than 15 calendar days have passed since receipt of notification from the contracting authority that it is unwilling to redress an objection (section 160 (3) sentence 1 no. 4 of the German Competition Act (Gesetz gegen Wettbewerbsbeschränkungen, GWB)). Additionally, applications for review are not permitted if an award has been made before the public procurement tribunal has informed the contracting authority about the application for review (sections 168 (2) sentence 1 and 169 (1) GWB). Contracts may be awarded 15 calendar days after the tenderer information pursuant to section 134 (1) GWB has been sent. If the information is sent electronically or by fax, the period shall be reduced to ten calendar days (section 134 (2) GWB). The period shall begin on the day after which the contracting authority sends the information; the date of receipt by the tenderer and candidate in question shall be irrelevant. The admissibility of a review application also requires that the applicant notified the contracting authority about the claimed violations of public procurement provisions within ten calendar days of becoming aware of them (section 160 (3) sentence 1 no. 1 GWB). Violations of public procurement provisions which become apparent from the tender notice must be notified to the contracting authority by the end of the time limit for the application or the submission of a tender specified in the notice (section 160 (3) sentence 1 no. 2 GWB). Violations of public procurement provisions which only become apparent from the procurement documents must be notified to the contracting authority by the end of the time limit for the application or the submission of a tender (section 160 (3) sentence 1 no. 3 GWB).
Postanschrift: Hansastraße 27c
Ort: München
Postleitzahl: 80686
Land: Deutschland
E-Mail:
Internet-Adresse: https://www.fraunhofer.de